Thermal Pads (TP-080 series UL certification)
TP-080 series with UL certification
High thermal conductivity and low thermal impedence
Ultra soft, highly conformable
Puncture, shear and tear resistant, easily workable
Designed for low-stress application
Gap fillers are silicone soft pads designed for the purpose of high
performance thermal conductivity.
The material can be easily manipulated to conform to the irregular
surface under moderate application pressures. It is widely applied
in electronic parts such as IC, CPU, LED, Laptops, PC, DVD
applications and more.
Thermal Conductivity ranges from 0.3W/mk to 4.0W/mk.
Thickness: 0.5mm to 10mm.
- Thermal conductivity ranges from normal to high.
- Self-adhesion performance to reduce contact resistance.
- High temperature endurance with UL recognised flame retardations
- Meet RoHS specifications.
Material can also be die-cut to customer's require dimensions.
Please contact us for more details.