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Thermal Insulation Silicone Soft Pad

Thermal Insulation Silicone Soft Pad

Place of Origin : China
Brand Name : AOK
Certification : UL, SGS
Model Number : TP150
MOQ : 100
Price : 10$
Delivery Time : 7 days
Payment Terms : TT
Supply Ability : 1,000,000
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The thermally conductive pad are thermal interface materials, which are used to fill in air gaps between heat-generating electronic device and heat sinks or metal housing or chassis for intimate contact over rough or uneven surface to eliminate air gaps and reduce thermal resistance with high conformability.

Feature of Thermal Insulation Silicone Soft Pad

1.Thermal conductivity:1.5W/m·k

2.Deformation force ultra-low, more effectively protect the electrial conponets.

3.High viscous surface, reduce the thermal contact conductance.

4.V-0 flame retardant Rating.


  • LED
  • High performance CPUs
  • High performance GPUs
  • Power conversion
  • Motion Control
  • Telecommunications
  • Computer and peripherals
  • Automotive electronics
  • Power semiconductors
  • Power supplies
  • Between heat-generating semiconductors or magnetic components and a heat sink
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader

The thickness of the product can be customized according to the customer's needs, you can also choose gum or single-sided sticky, easy to use

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